Next-Gen Chip Manufacturing

Cybersault Systems® provides end-to-end consulting and advisory for semiconductors, from architecture and design enablement to trusted packaging, qualification, and scale. We help customers convert concepts into qualified silicon while hardening the supply chain and ensuring mission-grade reliability. Our approach mirrors the clear, outcome-driven structure we use for data centers: strategy first, execution next, resilience always.

Strengthening supply chain resilience and security

Modern missions demand secure, traceable silicon. We implement zero-trust principles at the hardware level, cryptographic roots of trust, and provenance across the lifecycle. Our teams design secure test and provisioning flows, establish auditable material traceability, and align programs to regulatory and customer standards so that operations remain uninterrupted and compliant.

Integrating emerging technologies

We integrate next-generation capabilities so your devices remain high-performing and future-ready:

Design Enablement

Architecture to GDSII, IP planning, DFT, PPA optimisation, sign-off, MPW shuttles.

Advanced Packaging

FOWLP, flip-chip BGA, WLCSP, SiP, 2.5D interposers, 3D stacking with TSV and HBM.

Secure, Trusted Production

Hardware root of trust, key injection, full traceability, JEDEC and MIL-STD qualification.